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To laminate multi-layer printed circuit boards Candor uses a continuous copper foil lamination press, which is more consistent than a conventional press. Conventional lamination uses to thick steel plates that are heated up, using a lot of pressure to transfer heat to panels. Our CCF lamination process has a continuous roll of foil interlaced between manufacturing panels acting like a giant resistant heater directly against the panels. The direct heating is controlled by thermocouples inside the stack and direct computer lamination programs. This not only give us +-5% impedance calculations with ease (link to products) consistently due to even thickness and less squeeze out.
Customer Product Benefit
(Functional, Qualitative, Aesthetic)
Reduction of bow and twist
Significantly reduced Z-axis variation
Mechanical / Electrical Superiority and/or Stability
Panel to panel consistency
Structural deviation reduced
(Simple, Repetitive, Basic Technical Skills Required)
No heavy lifting required
Heating and cooling systems are computer controlled with set programs making operations easier
(Reduction in material usage, reuse, and recycling)
Reduction in heating and cure times, reducing power requirements
Recycle: Extra copper foil is recycled
(Surpass Restrictions with Less Water)
No water used!
Reduce Process Steps
The process is computer controlled with reduction in manual processing.
Process Control Advantage
(less monitoring, ease of use)
Using thermocouples reduces temperature variation giving superior controls for heat rise and pressure
Creating new designs and technologies require a partnership, the production process requires not only good product, but also knowledge and communication support.
The Candor sales and engineering teams are always ready to help and will respond to questions and quotes promptly.Contact Us