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An exciting new technology that allows Design Engineers to resolve space restrictions by eliminating via pad requirements is called Landless Via.
Traditional PCB manufacturing processes required an annular ring to facilitate proper plating in the hole and on the surface. Our plating methods allow us to eliminate this requirement, giving our customers a design advantage when dealing with HDI PCBs.
Creating new designs and technologies require a partnership, the production process requires not only good product, but also knowledge and communication support.
The Candor sales and engineering teams are always ready to help and will respond to questions and quotes promptly.Contact Us