Landless Via Technology

An exciting new technology that allows Design Engineers to resolve space restrictions by eliminating via pad requirements is called Landless Via.

How does Candor Produce Landless Via

Traditional PCB manufacturing processes required an annular ring to facilitate proper plating in the hole and on the surface. Our plating methods allow us to eliminate this requirement, giving our customers a design advantage when dealing with HDI PCBs.


  • Benefits blind and buried vias
  • Impedance requirements and regular through holes. Consistent impedance records for repeatability are second to none.
  • Greatly improves spacing issues with HDI and tight spacing requirement boards

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ISO 9001:2015 and CGRP Certified

Creating new designs and technologies require a partnership, the production process requires not only good product, but also knowledge and communication support.

The Candor sales and engineering teams are always ready to help and will respond to questions and quotes promptly.

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