Design Limits

Minimum Trace Width

0.005"

0.003"/0.003"

0.002"/0.002"

Outer Layer Via Pad Size

Class 3: 2 Mil, and capable up to landless via

0.002"

0.002" high density drilling

Line to Line Spacing

0.005"

0.003"/0.003"

0.002"/0.002"

Minimum Through Hole Drilled

0.012"

0.008"

0.004"

Minimum Buried Via Drilled

0.012"

0.006"

0.004"

Minimum Blind Via Drilled

0.012"

0.006"

0.004"

Blind Via Aspect Ratio

8:1 Aspect Ratio

1:1

1:1

Maximum PCB Thickness

300 mil

0.008-0.125"

0.002"-0.4"

Number of Layers

12 Layers

22 layers

40 layers

Controlled Impedance Tolerance

+- 5% or Under Tolerance

-0.05

-0.025

Maximum Board Size

19.5" X 22.5"

20.5 X 24.5"

20.5 X 26"

Copper Thickness/Density

Able to meet customer requirements.

.25-2oz

5microns-20oz

Minimum Drill-to-Conductor

6 Mil (edge of hole to track)

0.005"

0.003"

PCB Edge to Conductor

0.010"

0.005"

0.002"

Warp (Bow and Twist)

Exceeds IPC-TM-650

exceeds IPC Spec

exceeds IPC Spec

Solder Mask DAM

0.010"

0.005"

0.002"