Landless Via Technology
Reduce Space Constraints and Maximize PCB Real Estate
Candor’s innovative plating and photoresist technology eliminate annular rings. With sequential blind via capabilities and in-house expertise, we deliver high-quality, scalable PCB stack-ups faster than the competition.
What is a Landless Via?
Instead of relying on a surrounding copper pad for structural support and connectivity, the via itself is plated to ensure electrical continuity.
Landless via technology is a PCB design method where plated through-holes do not require an annular ring or pad instead using the via itself. This approach allows traces to be routed closer together, increasing density and optimizing space utilization. It is commonly used in high-density interconnect (HDI) designs where space constraints are critical. By eliminating the pad, landless vias enable more efficient layer stacking and improved electrical performance while maintaining mechanical reliability.
Benefits of landless vias
Landless via technology removes the traditional via pad, allowing traces to pass directly through the hole without the usual copper landing. This method improves routing density by reducing spacing constraints, enabling more compact PCB layouts. By eliminating pads, it streamlines design, enhances connectivity, and optimizes signal integrity.
Maximized PCB Real Estate
By eliminating via pads, landless via technology increases routing density, allowing more traces per layer and reducing overall PCB stack-up complexity.
Cost-Effective & Scalable Design
Fewer layers and optimized material use lower production costs while ensuring scalable, high-performance PCB manufacturing for advanced electronic applications.
Enhanced Signal Integrity
Landless vias improve impedance consistency and electrical performance, ensuring superior signal integrity and reliability over traditional annular ring designs.
Faster, High-Quality Builds
With in-house automation and expertise, Candor delivers rapid, precise PCB stack-ups, providing streamlined solutions without sacrificing quality or performance.