Other Specifications
Specifications
Achievable
Regular FR4
No Mask on Via, Partially Plugged, Plugged Mask with Via, and Non-conductive/conductive Epoxy
Solder Mask Colour
As per customer requirements
Silkscreen Colour
As per customer requirements
Liquid Photo Image-able Silkscreen
As per customer requirements
Board Finishes
Board Edge Plating
Conductive Carbon Ink
Conductive Via Fill
Non-Conductive Via Fill
Deep Soft Gold, Electrolytic Gold (Hard Gold)
ENIG (Electroless Nickel/Immersion Gold)
Hot Air Solder Level -HASL
Hot Air Tin Level – HAL (Lead Free)
Immersion Silver
Immersion Tin
OSP
Electrical Testing
Grid Test or Flying Probe Test