HDI and any-layer
Stacked microvias to 8 levels · staggered to 20 · laser blind vias to
2 mil · landless via technology · aspect ratios to 30:1 on thick boards
Toronto, Canada · since 1999
Advanced PCB fabrication for European buyers who need a second source.
Class 3 construction, built in one facility, quoted by the engineer who
will run the job. Canadian origin means duty-free entry to the EU under CETA.
40layers, rigid
1 milline and space
30:1aspect ratio
±2.5%impedance
2 millaser blind via
1–3 daysquick turn
We will tell you within 48 hours whether we can
build it, what it costs, and anything in the design worth flagging.
Second source, different continent
If your board supply runs through one region, a shipping disruption, an export
restriction or a single factory outage stops your line. We are a qualified
alternative in a NATO member state with no dependency on Asian capacity.
Zero tariff, no customs surprise
Canadian-origin goods enter the EU duty-free under CETA, and we supply the origin
declaration on the commercial invoice. Toronto to most of Western Europe is three to
five business days door to door by DHL Express, clearance included.
One facility, prototype to production
Imaging, lamination, drilling, plating, soldermask and test all happen in one
Toronto building. Nothing is subcontracted except lead-free HASL. That is why a
one-day turn is possible, and why the engineer who quotes your board can answer
questions about it.
- Quality system
- ISO 9001:2015 registered. Certificate Q106008, CWB Registration. Scope:
manufacture of printed circuit boards. Valid to August 2029.
Download the certificate - Build standard
- IPC-6012 Class 3 unless your drawing specifies otherwise. Class confirmed at quotation.
- Export control
- Registered under the Canadian Controlled Goods Program. Compliant with the Export
and Import Permits Act and Export Control List. - Facility
- Single site, Toronto, Ontario. Privately owned, 46 staff, operating since 1999.
Capability
What we build
Six areas where we are worth a conversation.
RF and microwave
Rogers 3000 / 4000 / 6000 series · TMM3 and TMM6 · Taconic TLY ·
PTFE with fusion bonding · impedance held to ±2.5%
Heavy copper and thermal
Copper to 20 oz · copper-core construction · press-fit embedded copper
coins plated over, to full board thickness · heat-sink attach
Flex and rigid-flex
Flex to 32 layers · rigid-flex to 32 · loose-leaf, formed and
bookbinder · polyimide and Kapton · EMI shielding
High-speed digital
Megtron 6 and 7 · Isola I-Tera MT40 and Tachyon · back-drilling to
±0.004″ · layer-to-layer registration to ±0.002″
Hybrid and unusual
Dissimilar-material stack-ups including PTFE with FR-4 · ceramic ·
brass, constantan, tin-lead alloy and aluminium foils to 2 mil line and space
Ninety specifications across layer count, dimensions, line and
space, drilling, microvias, registration, soldermask, impedance, via fill, materials,
finishes and equipment — in both imperial and metric.
Schedule
Lead times
Fabrication time from released data. Layer count and technology drive the schedule, and
every lead time is confirmed at quotation.
| Stage | Time |
|---|---|
| Quick-turn prototype | 1–3 business days |
| Standard production | 2–5 business days |
| Sequential lamination, HDI, rigid-flex | Confirmed at quotation |
| Transit to the EU, DHL Express | 3–5 business days door to door |
| Quotation | Within 48 hours |
RFQs sent overnight European time are answered the
same working day.
Process
Why those numbers are achievable
Any fabricator can print a specification table. This is what sits behind ours.
Panel plating, then print and etch
The whole panel is plated first, hole walls included, and the pattern is imaged and
etched afterwards — the reverse of the sequence most shops run. Because the hole
is already plated before imaging, it does not need a land to capture it. That is what
makes landless vias practical and holds reliability at high aspect ratios.
Induction lamination
Energy goes directly into the resin rather than heating the press. Cure is even
across every cycle, so thickness stays consistent through sequential laminations —
up to twenty of them. Effectively any material can be bonded, including PTFE fusion
bonding and high-temperature flex coverlay.
Picosecond laser ablation
A cold process. Material is removed without heat damage to surrounding structures,
which allows clean flex cutting, 2 mil blind vias and clean drilling in PTFE.
Graphite metallisation
A conductive colloid charges the via surface before plating, giving copper-to-copper
bonding rather than a chemical interface. Inner-layer junctions hold, so boards last
longer in the field.
Getting started
Working with us
Getting a quote
Send Gerber or ODB++ files with your stack-up and any special requirements. We
respond within 48 hours with a price, a lead time, and a note on anything in the design
we would flag before you commit to it.
Supplier qualification
We hold a complete pack: ISO certificate, Controlled Goods registration, process
flow, equipment list, capability matrix, completed vendor questionnaire, and REACH,
RoHS and conflict-minerals statements. Ask and we will send it.
First articles
Most European relationships start with a single board. We would rather quote one
part and prove the process than talk in generalities.
Send us a board
Tell us what you are building and we will tell you
whether we can make it. No obligation, and no follow-up unless you want one.
Sunny Patel — VP Engineering & Operations
sunny@candorind.com · +1 416 736 6306
Candor Industries Inc.
9-125 Martin Ross Avenue, Toronto, Ontario M3J 2L9, Canada