Understanding Sequential Blind and Buried Vias
Precision Connectivity for Complex PCB Designs
Sequential Blind or Buried Vias are considered “buried” because of how they are embedded inside of a PCB, between conductive layers. Buried vias provide connections to two or more internal layers of a PCB, as plated-through holes that do not connect to either outer layer.
Benefits of sequential blind / buried vias
Design Efficiency
Provide a reduced layer count
Allow designers to use fewer lamination layers
Connect multiple adjacent inner layers
Greatly simplify designs
Signal Performance
Improve signal integrity
Provide short, straight paths for signals between layers
Improved high-frequency performance
Lower capacitance
Electromagnetic Performance
Better shielding
Reduced electromagnetic interference (EMI)
Enhanced isolation between high-speed signals and other layers
Improved signal containment
Understanding Sequential Blind and Buried Vias
Precision Connectivity for Complex PCB Designs
Sequential Blind or Buried Vias are considered “buried” because of how they are embedded inside of a PCB, between conductive layers. Buried vias provide connections to two or more internal layers of a PCB, as plated-through holes that do not connect to either outer layer.
Ensuring Quality in Sequential Via Manufacturing
Candor’s precise mechanical drilling and advanced plating ensure defect-free Sequential Blind and Buried Vias. Rigorous quality assurance includes inspections, X-rays, and testing for reliability. We implement eco-friendly practices, recycling materials and minimizing water use. With streamlined manufacturing and innovative techniques, we deliver durable, high-performance PCBs that meet exacting standards for complex applications.
Maximize PCB Real Estate and Performance
Candor’s landless via technology removes pad requirements, resolving HDI PCB spacing constraints. This enables higher routing density, fewer layers, and expanded PCB real estate. By routing traces through holes without pads, we deliver cost-effective, scalable solutions with superior performance. Our precise builds, eco-friendly methods, and fast turnaround make landless vias ideal for innovative, efficient PCB designs tailored to your needs.
FAQ
Are blind and buried vias suitable for high-speed designs?
Blind and buried vias can be utilized to minimize signal distortion and maintain signal integrity in high-speed designs.
Can blind and buried vias be repaired or modified?
It is difficult to access buried vias for repairs or modifications, but blind vias can be accessed with careful consideration during the rework process.
What are the costs like for blind and buried vias?
The manufacturing costs of blind and buried vias are generally high because of their increased complexity. Cost impact depends on many factors including drill size, layer count, and aspect ratio. Drilling blind and buried vias can have a reduction in field failures and reduce costs from expensive laser pre and post-processing.
Can blind and buried vias be used in single-sided or double-sided PCBs?
Blind and buried vias are used in multilayer PCBs because of the requirements of interconnections between specific layers. Blind and buried vias are not typically used in single or double-sided PCBs.