To laminate multi-layer printed circuit boards Candor uses a continuous copper foil lamination press, which is more consistent than a conventional press. Conventional lamination uses to thick steel plates that are heated up, using a lot of pressure to transfer heat to panels. Our CCF lamination process has a continuous roll of foil interlaced between manufacturing panels acting like a giant resistant heater directly against the panels. The direct heating is controlled by thermocouples inside the stack and direct computer lamination programs. This not only give us +-5% impedance calculations with ease (link to products) consistently due to even thickness and less squeeze out.
Streamlined Manufacturing Process: Why use Continuous Foil Lamination?
Customer Product Benefit
(Functional, Qualitative, Aesthetic)
Mechanical / Electrical Superiority and/or Stability
(Simple, Repetitive, Basic Technical Skills Required)
(Reduction in material usage, reuse, and recycling)
Reduction in heating and cure times, reducing power requirements
Recycle: Extra copper foil is recycled
(Surpass Restrictions with Less Water)
Process Control Advantage
(less monitoring, ease of use)