Apr 11, 2022|Product Innovations and Design, Technological Advancements and Materials

If you’re building an integrated circuit for a PCB, you may wonder what kind of IC packaging is best for it. You can choose from a variety of types of IC packaging. They’re all different sizes and have different numbers of pins. We’ll cover the common IC packaging types for PCBs, as well as factors you need to consider when choosing one. 

Common IC Packaging Types

  • Double In-Line Package
  • Small Outline Package
  • QFP (Quad Flat Package)
  • Ball Grid Array Package
  • Chip Scale Package

Double In-Line Package – On a double in-line package (DIP), the terminals are connected to the two sides, which can be made of either ceramic or plastic. DIP packages can be used in logic chips, memory chips, and microcomputer chips. Spacing between the pins is usually 15.2 mm. Some packages are as wide as 7.52 mm and 10.16 mm – these are referred to as skinny DIP and slim DIP, or narrow-body DIP. Typically, they aren’t differentiated and are just called DIPS. 

Small Outline Package – On a small outline package, the pins are arranged in the shape of an L on either side. They can be made of both plastic and ceramic materials. Along with memory LSIs, small-outline packages are commonly found in integrated circuits such as ASSPs. Their pin spacing is 1.27 mm, and they contain between 8 and 44 pins. They derive some other types  of IC packages, such as:

  • SOJ (small out-line J-Leaded package)
  • TSOP (Thin Small Outline Package)
  • SSOP (Shrink Small Outline Package) – The pin spacing is 0.635 mm.
  • TSSOP (Thin Shrink Small Outline Package) – This package type has a thinner outline than SOP. The pin spacing is 0.65 mm.
  • QSOP (Quarter-size small outline package): The pin spacing is .0635 mm. 
  • VSOP (Very Small Outline Package) – It’s a smaller package than QSOP, and the pins can be spaced from 0.4 to .65 mm apart. 


QFP (Quad Flat Package) –  These lead connectors form an L shape, and they’re made of ceramic, metal, and plastic. Plastic counts for most of them. The pin spacings include 1.0 mm, 0.8 mm, 0.65 mm, 0.5 mm, 0.4 mm, 0.3 mm, and other specifications. The largest pin count in a 0.65 mm package is 304. 

Ball Grid Array Package – This package has sphere-shaped bumps on the reverse side of the circuit board in place of the lead, with the integrated circuit attached to the front of the board, which is then sealed with a potting or resin compound. There can be more than 200 pins in a ball grid array package. 

Chip Scale Package – This package comes very close to an assembly ratio of 1:1. Only 32 square millimeters of area are covered, equal to one-third the overall size of ordinary BGA, one-sixth of TSOP’s chip area. Using the same amount of space, a CSP package can triple the amount of storage of a BGA package. 

What Are IC Packages? 

IC, or integrated circuit, packaging makes up a chip’s size and shape. Two chips may have the same electronic parameters but have different package types. DIP dual-in-line and SMD chip packages are the most common IC package types. Wave and reflow soldering are used for assembly. 

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Why Are IC Packages Important? 

It is just as important to consider the integrated circuit packaging as the integrated circuit, or semiconductor device, within it. Its main purpose is to prevent physical damage to the semiconductor circuit. It also prevents corrosion of the circuit and is responsible for the arrangement of electrical contacts from the semiconductor device over the circuit board. This is important to consider for both IC designing and  PCB designing. 

How Many IC Packages Are There? 

There are 45 different IC packages. 

What Are the IC Packages Types? 

Each IC package type has its own characteristics, and most ICs come with multiple packages. The best way to understand the packages is to understand how they’re classified. 

Through-Hole Mount Packages

Double In-line Package

The pins on these packages are arranged in two parallel rows along the package length, and they hang downwards vertically. 


Standard is the most common and popular type of IC packaging. Many PCB manufacturers and companies in the electronics industry rely on this type of packaging. The pins are spaced 0.1 inches apart, and the spacing between the rows is 7.62 mm. 


Shrink mounting packages are similar to standard ones, but the lead pitch is 1.778 mm. They’re a little smaller and tend to use high-pin density packaging. 

Surface Mount Packaging

Small Outline Packaging

These packages have two rows of terminals and a surface mount mounting style. The terminals can be J-shaped, L-shaped, or leadless. 

Quad Flat Package

The leads are out in an L-shape from the four sides. Plastic packing, ceramic, or metal accounts for most of the other materials. Types of quad flat packaging include flat quad packaging, thin flat quad packaging, plastic quad flat packaging, quad flat package with bumper, or quad flat non-leaded package. 

Ball Grid Array Package 

Ball Grid Array packages are one of the most famous and widely used packages nowadays. Whenever the work is compact or the gadget needs to be minimized, ball grid array packages are used. The printed surface has spherical bumps behind to replace the lead. The LSI chip is mounted on the front surface of the PCB board, and a resin is molded to seal it. It can’t have more than 200 pins. 

Chip Scale Packaging 

Chip scale packing is even better than BGA. It’s very small and can hold three times as much data as the BGA. 

Through-Hole Mounting vs. Surface Mounting

IC packages can be classified as being through-hole mounted or surface mounted. The PCB leads of through-hole-mounted packages are inserted through holes before soldering. Through-hole mounting is designed to work with PCBs containing both exterior and interior tracks. 

It is easier and more convenient to work with through-hole packages. Such packages can be used on breadboards and prototype boards. Although surface-mounted technology was developed after through-hole mounting, through-hole mounting continues to be used in commercial circuits when surface mounting isn’t an option. Inductors, heat sinks, and transformers are all semiconductor components that require through-hole mounting. 

What Are the Three Basic Types of Linear IC Packages?

The three basic types of linear IC packages are single inline packages, single shrink inline packages, and single inline package with heatsink. 

Which Are the Two Types of IC Packaging Material? 

The two main types of IC packaging material are through-hole devices and dual in-line packages. 

What Are PCB Packages?

PCB packages are the actual electronic components, chips, and other parameters shown by using graphics, so that they can be called when the PCB diagram is drawn. It’s also the size of the pad on the board when the component is soldered to the PCB. 

Selecting the Right IC Package for Your Application

It’s important to choose the right IC package for your application. That way you avoid damage and corrosion. So how do you choose the right package? 

Consider the number of I/Os – The number of I/Os is important when choosing a package. BGAs have the highest number of pins, but if you need an IC package with a lower pin count, the QFN package is best. 

Heat management – Next, you need to consider heat management. Today, IC sizes tend to be smaller but have more extensive solder masks to prevent thermal and electrical components from leaking. Be sure to discuss your needs with your PCB supplier. BGAs tend to have better heat dissipation, which is why you might want to use them. 

High-speed I/Os – When looking at IC packaging, consider whether you have high-speed I/Os. You don’t want to interfere with the package’s quality at any time to interconnect the IC’s I/O signals. Flip BGAs have the best high-frequency signals. 

PCB assembly – The last thing to consider is PCB assembly. Can you have your IC package assembled in the shortest time possible? Make sure you consider this beforehand because not every provider can give you what you want. 


That’s what you need to know about IC packaging, why it’s important, and the different types of IC packaging you can choose from. As you decide what kind of IC packaging to use for your circuits, think about the four things mentioned earlier – the number of I/Os, heat management, whether you need high-speed I/Os, and the PCB assembly.

Author Profile

Sunny Patel
Sunny Patel is the Engineering and Sales Manager at Candor Industries. Sunny is trained as a IPC-A-600 trainer, AS9100 Lead auditor, IPC CID and got his Engineering degree at the University of Toronto.